One thing I'd take issue with though is no clean flux for hand soldering. "No clean" formulations are almost universally designed for reflow oven temperature profiles and may not actually meet their specifications for electrical/chemical safety to leave on the board without cleaning when hand soldered. They are also commonly _more_ difficult to clean if you want/need to. Given that non-no clean formulations are likely both easier to clean and more reliable over time when hand soldered, they're my preference for rework.
One thing I'd take issue with though is no clean flux for hand soldering. "No clean" formulations are almost universally designed for reflow oven temperature profiles and may not actually meet their specifications for electrical/chemical safety to leave on the board without cleaning when hand soldered. They are also commonly _more_ difficult to clean if you want/need to. Given that non-no clean formulations are likely both easier to clean and more reliable over time when hand soldered, they're my preference for rework.